Pace Tf2800 Bga Ve Smd Tamir Sistemi

Pace Marka Tf2800 Bga And Smd Rework System adlı malzemeyi Pace Türkiye Distribütörü firmamızdan temin edebilirsiniz.

Konvansiyonel rezistanslı ısıtma teknolojisi, çeşitli BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 ve diğer alt sonlandırılmış bileşenleri takmak ve çıkarmak için konvektif yeniden işleme istasyonlarında yıllardır başarıyla kullanılmaktadır. Bununla birlikte, günümüzün son derece yüksek termal kütle panoları, ultra ince hatve bileşenleri ve zorlu üretim yeniden işleme ortamları, her zamankinden daha fazla proses kontrolü, termal performans ve daha hızlı üretim gerektirir.

PACE'in TF 2800 BGA / SMD'sini girin Rework Sistemi. Çığır açan, patent bekleyen Endüktif-Konveksiyonlu Isıtma Teknolojisi ile TF 2800'ün üst taraf ısıtıcısı, neredeyse güvenli ve hızlı lehim bağlantısı yeniden akışı için birkaç saniye içinde hedef sıcaklığa ulaşır herhangi bir bileşen yükleme veya kaldırma uygulaması.

Ultra-Precise 28µm Placement Accuracy
Revolutionary Inductive-Convection Heater
Active Cooling Through Nozzle Provides Rapid Solder Cooldown
4 Thermocouple Inputs
Adjustable Height Bottom-Side IR Preheater
Board Support Beam
Precision 24 x 24 PCB Holder
Auxiliary Cooling Fan
Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
Single-Axis Operation
Windows 10 Micro PC with 24 LCB Monitor
Operator-Friendly Software Suite
Made in the USA

Power Requirements	120 VAC, 50-60Hz (requires 20 A supply)|| 230 VAC, 50-60Hz (requires 10 A supply); 1600W maximum
Dimensions	737mm (29) H x 1118mm (44) W x 965mm (38) D
Weight (Without Computer)	90kg (200lbs)
Top-side Heater	Inductive-Convection Heater, 300 Watts
Bottom Side Heater	Medium/Long wave IR, 1900 Watts; 405mm (16) x 405mm (16) || (1 x 1000 Watts 6 x 150 Watts)
Bottom Heater Adjustable Height	Can be raised up to 38mm (1.5) closer to the PCB
Active Cooling Capability	Offers swift, yet controlled component/PCB cooling, directly through the nozzle
High Sensitivity Vacuum Pick	Counterweight balanced with an optical sensor and precision high temperature linear ball bearings (includes 7 picks)
Precision Placement Capability	Placement system utilizes a stepper motor and position encoding for precise movement
Placement Accuracy	28μm (.0011) accuracy
Integrated Board Support Beam	2 standard supports, 1 x support wand 1 x fixed center height adjustment, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB.
Temperature Setting Range	Top Heater: 100˚ to 328˚C (212˚ - 624˚F); Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)
Max PCB Size	Maximum: 610mm x 610mm (24 x 24); Minimum: N/A arms close down completely
Max/Min Component Size	Maximum: 65mm (2.5) x 65mm (2.5); Minimum: 1mm Sq.
Thermocouple Inputs	Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)
High Definition Optical Alignment	Vision Overlay System (VOS) with High Definition 1080p color camera
Vision Overlay System (VOS)	Contains integrated frame grabber and dichroic beam-splitting prism with independantly controlled LED lighting
VOS Zoom Capability	Up to 240x zoom capability, with Stable Zoom and image stabilization
Quad-Field Imaging	Allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
Single Axis Operation	All operations are complete in a single axis, eliminating risk of component movement after placement/reflow
Auxiliary Cooling Fan	Standard
Software	Intuitive, user-friendly, Windows software guides operators through profile development and execution
Computer System	Windows 10 PC, with wireless mouse and keyboard
Video Monitor	607mm (24) wide screen flat panel monitor (includes Monitor Arm Mounting Kit)
Maximum Airflow	Self contained pump, PC controlled, adjustable up to 30 SLPM
Component Nests	Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.
Heat Focusing, Vented Nozzles	5 nozzles included; over 90 nozzles available
Flux Application Plate	Included; allows for automated flux dipping
Stencils/Solder Paste Application	Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process
PV-65 Pik-Vac Vacuum Wand	Included; provides a manual vacuum pick-up capability for handling SMDs, with 15 minute auto-off feature
Warranty	One Year Limited Warranty

Top-Side Heater: Fast Heat Up - Rapid Cool Down

 PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 2800 immediately drops to temperatures well below solder melt when the heater is de-energized (results shown for TF 1800 Heater). 
  
 
 

 

How Inductive-Convection Heating Works

The TF 2800’s patented Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.

1.) The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber.  2.) After entering the inner chamber, the pre-heated air is then heated to target temperature through a highly efficient heat transfer process in an energized induction field. 3.) During active cooling, the induction coil is de-energized and the TF 2800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.

Powerful, Energy Efficient Performance

The TF 2800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required by yesterday’s conventional heating technology.

Advanced Features

Ultra-High Precision Placement Capability

Newly designed motorized reflow head is driven by an advanced stepper motor system which provides smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy.

 

 

High Sensitivity Vacuum Pick Assembly

New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement and pick-up. Includes 7 Vacuum Picks.

 

 

PACE Exclusive Height Adjustable Bottom-Side Preheater

An array of 7 high powered IR emitters respond to high mass assemblies faster with 1900W of power. Preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high thermal mass boards.

 

 

High-Definition Optical Alignment System

An automated Vision Overlay System uses a beam-splitting prism for simultaneous view of PCB pads and balls, high intensity LEDs for shadow-free lighting, and new high definition 1080p camera to easily align any component.

 

 

Crisp Clear Images for Component Alignment

A high definition Vision Overlay System uses bright white LEDs with independent intensity control and up to 240x zoom capability to provide precise distinction of pads and solder ball or leads.

 

 

Quad-Field Imaging for Large/Fine Pitch BGA's

Quad-Field Imaging allows up to four corners of a large component (and its pads) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs.

 

 

Fourth Generation Software Suite

Newly designed Windows-based software provides a simple graphical interface with intuitive set-up and profiling, on-the-fly profile adjustment, unlimited profile storage and much more.